![]() Sputtering is one of the main processes of manufacturing optical waveguides and is another way for making efficient photovoltaic solar cells. Hard disk surfaces use sputtered CrO x and other sputtered materials. aluminium) layer during the fabrication of CDs and DVDs. Sputtering is also used as the process to deposit the metal (e.g. A large industry has developed around tool bit coating using sputtered nitrides, such as titanium nitride, creating the familiar gold colored hard coat. The coating is a multilayer containing silver and metal oxides such as zinc oxide, tin oxide, or titanium dioxide. Another familiar application of sputtering is low- emissivity coatings on glass, used in double-pane window assemblies. Because of the low substrate temperatures used, sputtering is an ideal method to deposit contact metals for thin-film transistors. Thin antireflection coatings on glass for optical applications are also deposited by sputtering. Sputtering is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing. One of the earliest widespread commercial applications of sputter deposition, which is still one of its most important applications, is in the production of computer hard disks. The availability of many parameters that control sputter deposition make it a complex process, but also allow experts a large degree of control over the growth and microstructure of the film. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters. Reactive gases can also be used to sputter compounds. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. The sputtering gas is often an inert gas such as argon. The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The sputtered ions (typically only a small fraction of the ejected particles are ionized - on the order of 1 percent) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering). Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. Method of thin film application A schematic of sputter deposition.
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